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Shape optimization of micro-channel heat sink for micro-electronic cooling
Afzal Husain
*
, Kwang Yong Kim
*
Corresponding author for this work
Research output
:
Contribution to journal
›
Article
›
peer-review
91
Citations (Scopus)
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Engineering & Materials Science
Electronic cooling
100%
Heat sinks
77%
Shape optimization
75%
Microelectronics
75%
Heat transfer
31%
Quadratic programming
26%
Laminar flow
25%
Heat resistance
24%
Flow of fluids
21%
Silicon
18%
Flow rate
17%
Substrates
16%
Cooling
16%
Fluids
14%
Neural networks
14%
Water
12%
Chemical Compounds
Electronic cooling
100%
Heat sinks
77%
Shape optimization
75%
Microelectronics
75%
Heat transfer
31%
Silicon
28%
Laminar flow
25%
Heat resistance
24%
Flow of fluids
21%
Flow rate
17%
Substrates
16%
Cooling
16%
Water
15%
Fluids
14%
Neural networks
14%