Electroosmotically enhanced microchannel heat sinks

Afzal Husain, Kwang Yong Kim

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

The present study investigates the microchannel heat sink for pure electroosmotic, pressure-driven, and mixed (electroosmotic and pressure-driven) flows. A three-dimensional numerical analysis is performed for electroosmotic and mixed flows. Electroosmotic flow (EOF) induced in an ionic solution in the presence of surface charge and electric field is investigated with hydrodynamic pressure-driven flow (PDF) to enhance heat removal through the microchannel heat sink. In a pressure-driven microchannel heat sink, the application of an external electric field increases the flow rate that consequently reduces the thermal resistance. The effects of ionic concentration represented by the zeta potential and Debye thickness are studied with the various steps of externally applied electric potential. A higher value of zeta potential leads to higher flow rate and lower thermal resistance, which consequently reduce the temperature of the microprocessor chip and load of the micropump used to supply coolant to the microchannels.

Original languageEnglish
Pages (from-to)814-822
Number of pages9
JournalJournal of Mechanical Science and Technology
Volume23
Issue number3
DOIs
Publication statusPublished - Jun 2009

Fingerprint

Heat sinks
Microchannels
Zeta potential
Heat resistance
Electric fields
Flow rate
Surface charge
Coolants
Microprocessor chips
Numerical analysis
Hydrodynamics
Electric potential
Temperature

Keywords

  • Electroosmotic flow
  • Microchannel heat sink
  • Numerical simulation
  • Thermal resistance

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Electroosmotically enhanced microchannel heat sinks. / Husain, Afzal; Kim, Kwang Yong.

In: Journal of Mechanical Science and Technology, Vol. 23, No. 3, 06.2009, p. 814-822.

Research output: Contribution to journalArticle

@article{29186b8ae7b84ef6bd09332326463277,
title = "Electroosmotically enhanced microchannel heat sinks",
abstract = "The present study investigates the microchannel heat sink for pure electroosmotic, pressure-driven, and mixed (electroosmotic and pressure-driven) flows. A three-dimensional numerical analysis is performed for electroosmotic and mixed flows. Electroosmotic flow (EOF) induced in an ionic solution in the presence of surface charge and electric field is investigated with hydrodynamic pressure-driven flow (PDF) to enhance heat removal through the microchannel heat sink. In a pressure-driven microchannel heat sink, the application of an external electric field increases the flow rate that consequently reduces the thermal resistance. The effects of ionic concentration represented by the zeta potential and Debye thickness are studied with the various steps of externally applied electric potential. A higher value of zeta potential leads to higher flow rate and lower thermal resistance, which consequently reduce the temperature of the microprocessor chip and load of the micropump used to supply coolant to the microchannels.",
keywords = "Electroosmotic flow, Microchannel heat sink, Numerical simulation, Thermal resistance",
author = "Afzal Husain and Kim, {Kwang Yong}",
year = "2009",
month = "6",
doi = "10.1007/s12206-009-0206-x",
language = "English",
volume = "23",
pages = "814--822",
journal = "Industrial & Engineering Chemistry Product Research and Development",
issn = "0888-5885",
publisher = "American Chemical Society",
number = "3",

}

TY - JOUR

T1 - Electroosmotically enhanced microchannel heat sinks

AU - Husain, Afzal

AU - Kim, Kwang Yong

PY - 2009/6

Y1 - 2009/6

N2 - The present study investigates the microchannel heat sink for pure electroosmotic, pressure-driven, and mixed (electroosmotic and pressure-driven) flows. A three-dimensional numerical analysis is performed for electroosmotic and mixed flows. Electroosmotic flow (EOF) induced in an ionic solution in the presence of surface charge and electric field is investigated with hydrodynamic pressure-driven flow (PDF) to enhance heat removal through the microchannel heat sink. In a pressure-driven microchannel heat sink, the application of an external electric field increases the flow rate that consequently reduces the thermal resistance. The effects of ionic concentration represented by the zeta potential and Debye thickness are studied with the various steps of externally applied electric potential. A higher value of zeta potential leads to higher flow rate and lower thermal resistance, which consequently reduce the temperature of the microprocessor chip and load of the micropump used to supply coolant to the microchannels.

AB - The present study investigates the microchannel heat sink for pure electroosmotic, pressure-driven, and mixed (electroosmotic and pressure-driven) flows. A three-dimensional numerical analysis is performed for electroosmotic and mixed flows. Electroosmotic flow (EOF) induced in an ionic solution in the presence of surface charge and electric field is investigated with hydrodynamic pressure-driven flow (PDF) to enhance heat removal through the microchannel heat sink. In a pressure-driven microchannel heat sink, the application of an external electric field increases the flow rate that consequently reduces the thermal resistance. The effects of ionic concentration represented by the zeta potential and Debye thickness are studied with the various steps of externally applied electric potential. A higher value of zeta potential leads to higher flow rate and lower thermal resistance, which consequently reduce the temperature of the microprocessor chip and load of the micropump used to supply coolant to the microchannels.

KW - Electroosmotic flow

KW - Microchannel heat sink

KW - Numerical simulation

KW - Thermal resistance

UR - http://www.scopus.com/inward/record.url?scp=70349615628&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=70349615628&partnerID=8YFLogxK

U2 - 10.1007/s12206-009-0206-x

DO - 10.1007/s12206-009-0206-x

M3 - Article

AN - SCOPUS:70349615628

VL - 23

SP - 814

EP - 822

JO - Industrial & Engineering Chemistry Product Research and Development

JF - Industrial & Engineering Chemistry Product Research and Development

SN - 0888-5885

IS - 3

ER -