Antimicrobial properties of vertically aligned nano-tubular copper

Kafil M. Razeeb*, Joanna Podporska-Carroll, Mamun Jamal, Maksudul Hasan, Michael Nolan, Declan E. McCormack, Brid Quilty, Simon B. Newcomb, Suresh C. Pillai

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

17 Citations (Scopus)

Abstract

In this work, the antimicrobial properties of vertically aligned nano-tubular Cu arrays (NT-Cu) fabricated via a template-based electrodeposition approach were investigated. The NT-Cu display good bactericidal activity against Staphylococcus aureus and bacteriostatic properties against Escherichia coli, Shigella sonnei, Salmonella enterica and Candida albicans. In contrast, Cu-foil electrodeposited from the same solution shows low biological activity against the same microorganisms. The antimicrobial activity of NT-Cu depends on both the type of microorganism and exposure time. After 6 h of exposure, over 99.99% (log red=4.43) of S. aureus population was inactivated, whereas, for E. coli, S. sonnei, S. enterica and C. albicans, the inactivation was 97.8, 94.2, 89.9, and 90.3%, respectively.

Original languageEnglish
Pages (from-to)60-63
Number of pages4
JournalMaterials Letters
Volume128
DOIs
Publication statusPublished - Aug 1 2014
Externally publishedYes

Keywords

  • Antimicrobial
  • Bacteria
  • Electrodeposition
  • Nano-tubular copper

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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