Chemical Compounds
Boundary conditions
6%
Direction compound
12%
Electronic equipment
6%
Flow rate
6%
Heat flux
7%
Heat resistance
8%
Heat sinks
89%
Heat transfer
5%
Hot Temperature
39%
Laminar flow
26%
Numerical analysis
7%
Pressure drop
7%
Reynolds number
6%
Silicon
100%
Substrates
5%
Temperature distribution
6%
Thermal management (electronics)
12%
Turbulent flow
8%
Engineering & Materials Science
Boundary conditions
6%
Electronic equipment
6%
Flow rate
6%
Heat flux
7%
Heat resistance
8%
Heat sinks
89%
Heat transfer
5%
Hot Temperature
39%
Laminar flow
26%
Numerical analysis
7%
Pressure drop
7%
Reynolds number
6%
Silicon
64%
Substrates
5%
Temperature distribution
6%
Thermal management (electronics)
12%
Turbulent flow
8%