Chemical Compounds
Silicon
100%
Heat sinks
89%
Hot Temperature
39%
Laminar flow
26%
Thermal management (electronics)
12%
Direction compound
12%
Heat resistance
8%
Turbulent flow
8%
Pressure drop
7%
Heat flux
7%
Numerical analysis
7%
Electronic equipment
6%
Reynolds number
6%
Temperature distribution
6%
Boundary conditions
6%
Flow rate
6%
Substrates
5%
Heat transfer
5%
Engineering & Materials Science
Heat sinks
89%
Silicon
64%
Hot Temperature
39%
Laminar flow
26%
Thermal management (electronics)
12%
Heat resistance
8%
Turbulent flow
8%
Pressure drop
7%
Heat flux
7%
Numerical analysis
7%
Electronic equipment
6%
Reynolds number
6%
Temperature distribution
6%
Boundary conditions
6%
Flow rate
6%
Substrates
5%
Heat transfer
5%