Thermal characterization of multiple micro-jet impingement cooling model

Afzal Husain, Jun Hee Kim, Kwang Yong Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The present study investigated thermal performance of silicon-based multiple micro-jet impingement cooling heat sink for thermal management of electronics. Three-dimensional numerical analysis was performed for steady incompressible laminar flow and conjugate heat transfer through a finite volume solver. A heat flux of 100 W/cm2 was applied at one side of the silicon substrate, while at the other side jet impingement system was designed. The jet plate was consisted of many jet holes whereas computational domain was simplified by utilizing symmetric boundary conditions along the flow as well as lateral directions. The effect of various design parameters, namely, jet diameter, jet pitch, standoff (distance from jet exit to impingement surface) etc., have been analyzed at jet Reynolds numbers 100, 200 and 300 under laminar flow conditions. In view of the low pumping powers available through micro-pumping systems, low flow rates were applied for the analysis. The cross-flow effects of the spent-flow were investigated for finding out optimum design parameters and flow conditions for the heat sink. The temperature distribution was discussed for various values of jet diameter, standoff and jet-to-jet spacing. While a moderate thermal resistance of the heat sink was obtained under laminar flow conditions, high performance can be achieved for higher flow-rate turbulent flow conditions at the expense of excessive pressure-drop which would be investigated in future studies.

Original languageEnglish
Title of host publicationASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2014, Collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting
PublisherWeb Portal ASME (American Society of Mechanical Engineers)
ISBN (Print)9780791846278
DOIs
Publication statusPublished - 2014
EventASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2014, Collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting - Chicago, United States
Duration: Aug 3 2014Aug 7 2014

Other

OtherASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2014, Collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting
CountryUnited States
CityChicago
Period8/3/148/7/14

ASJC Scopus subject areas

  • Process Chemistry and Technology

Fingerprint Dive into the research topics of 'Thermal characterization of multiple micro-jet impingement cooling model'. Together they form a unique fingerprint.

  • Cite this

    Husain, A., Kim, J. H., & Kim, K. Y. (2014). Thermal characterization of multiple micro-jet impingement cooling model. In ASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2014, Collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting Web Portal ASME (American Society of Mechanical Engineers). https://doi.org/10.1115/ICNMM2014-21736