TY - GEN
T1 - Quasi static analysis of hybrid and monolithic integrated circuits interconnections
AU - Affarie, M.
AU - Bourdoucen, H.
PY - 1993
Y1 - 1993
N2 - The integrated circuits interconnections are analyzed in quasi-static mode using the method of lines . The coupling capacitances are determined for monolithics and hybrid structures having parallel multiconductors at two different dielectric layer interfaces. The anisotropy effects on the coupling between crossing conductors are investigated for different dimensions of strip width, and substrate thickness. The anisotropy effect on the couplings increases with wider strips and thinner substrates. The coupling capacitances are also investigated for parallel conductors on an isotropic substrate. For parallel coplanar conductors the couplings increase with closer strips and thicker substrates, while for conductors on different interfaces, the coupling capacitance increases for wider strips and thinner substrates. Also the strips number affects the couplings for thicker dielectric substrates.
AB - The integrated circuits interconnections are analyzed in quasi-static mode using the method of lines . The coupling capacitances are determined for monolithics and hybrid structures having parallel multiconductors at two different dielectric layer interfaces. The anisotropy effects on the coupling between crossing conductors are investigated for different dimensions of strip width, and substrate thickness. The anisotropy effect on the couplings increases with wider strips and thinner substrates. The coupling capacitances are also investigated for parallel conductors on an isotropic substrate. For parallel coplanar conductors the couplings increase with closer strips and thicker substrates, while for conductors on different interfaces, the coupling capacitance increases for wider strips and thinner substrates. Also the strips number affects the couplings for thicker dielectric substrates.
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M3 - Conference contribution
AN - SCOPUS:0027273186
SN - 0780307941
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1055
EP - 1060
BT - Proceedings - Electronic Components and Technology Conference
PB - Publ by IEEE
T2 - 1993 Proceedings of the 43rd Electronic Components and Technology Conference
Y2 - 1 June 1993 through 4 June 1993
ER -