Quantifying dissipative contributions in nanoscale interactions

Sergio Santos, Karim R. Gadelrab, Tewfik Souier, Marco Stefancich, Matteo Chiesa

Research output: Contribution to journalArticle

20 Citations (Scopus)

Abstract

Imaging with nanoscale resolution has become routine practice with the use of scanning probe techniques. Nevertheless, quantification of material properties and processes has been hampered by the complexity of the tip-surface interaction and the dependency of the dynamics on operational parameters. Here, we propose a framework for the quantification of the coefficients of viscoelasticity, surface energy, surface energy hysteresis and elastic modulus. Quantification of these parameters at the nanoscale will provide a firm ground to the understanding and modelling of tribology and nanoscale sciences with true nanoscale resolution.

Original languageEnglish
Pages (from-to)792-800
Number of pages9
JournalNanoscale
Volume4
Issue number3
DOIs
Publication statusPublished - Feb 7 2012

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Interfacial energy
Tribology
Viscoelasticity
Hysteresis
Materials properties
Elastic moduli
Scanning
Imaging techniques

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Santos, S., Gadelrab, K. R., Souier, T., Stefancich, M., & Chiesa, M. (2012). Quantifying dissipative contributions in nanoscale interactions. Nanoscale, 4(3), 792-800. https://doi.org/10.1039/c1nr10954e

Quantifying dissipative contributions in nanoscale interactions. / Santos, Sergio; Gadelrab, Karim R.; Souier, Tewfik; Stefancich, Marco; Chiesa, Matteo.

In: Nanoscale, Vol. 4, No. 3, 07.02.2012, p. 792-800.

Research output: Contribution to journalArticle

Santos, S, Gadelrab, KR, Souier, T, Stefancich, M & Chiesa, M 2012, 'Quantifying dissipative contributions in nanoscale interactions', Nanoscale, vol. 4, no. 3, pp. 792-800. https://doi.org/10.1039/c1nr10954e
Santos, Sergio ; Gadelrab, Karim R. ; Souier, Tewfik ; Stefancich, Marco ; Chiesa, Matteo. / Quantifying dissipative contributions in nanoscale interactions. In: Nanoscale. 2012 ; Vol. 4, No. 3. pp. 792-800.
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