Numerical optimization of a electroosmotically enhanced microchannel heat sink

Afzal Husain, Kwang Yong Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A liquid flow microchannel heat sink has been studied with the help of three-dimensional numerical analysis for mixed (electroosmotic and pressure-driven) flow. The optimization of the microchannel heat sink has been performed with the help of surrogate method coupled with multi-objective evolutionary algorithms. The effects of ionic concentration represented by the zeta potential and Debye thickness are studied at various levels of externally applied electric potential. Temperature dependent coolant properties are considered to take into account the micro-scale effects for accurately predicting the thermal performance of the microchannel heat sink. Higher value of zeta potential leads to higher flow-rate and lower thermal resistance which consequently reduced the temperature of the microprocessor chip and load of micro-pump used to supply the coolant to the microchannels. Two design variables are selected related to the microchannel width, depth and fin width and design space is explored through four-level full factorial design. The channel width-to-depth ratio is found to be higher Pareto-sensitive (sensitivity along the Pareto-optimal front) than the other design variable. The trade-off between objective functions and Pareto-sensitivity of the design variables can be utilized to economically design the microchannel heat sinks. In view of the limiting pumping power available at the micro-level the application of the electroosmosis along with the commonly used pumping source can greatly enhance the performance of the microchannel heat sink.

Original languageEnglish
Title of host publicationProceedings of the ASME InterPack Conference 2009, IPACK2009
Pages175-182
Number of pages8
Volume1
DOIs
Publication statusPublished - 2010
Event2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, United States
Duration: Jul 19 2009Jul 23 2009

Other

Other2009 ASME InterPack Conference, IPACK2009
CountryUnited States
CitySan Francisco, CA
Period7/19/097/23/09

Fingerprint

Heat sinks
Microchannels
Zeta potential
Coolants
Electroosmosis
Heat resistance
Evolutionary algorithms
Microprocessor chips
Numerical analysis
Flow rate
Pumps
Temperature
Liquids
Electric potential

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Husain, A., & Kim, K. Y. (2010). Numerical optimization of a electroosmotically enhanced microchannel heat sink. In Proceedings of the ASME InterPack Conference 2009, IPACK2009 (Vol. 1, pp. 175-182) https://doi.org/10.1115/InterPACK2009-89236

Numerical optimization of a electroosmotically enhanced microchannel heat sink. / Husain, Afzal; Kim, Kwang Yong.

Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 1 2010. p. 175-182.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Husain, A & Kim, KY 2010, Numerical optimization of a electroosmotically enhanced microchannel heat sink. in Proceedings of the ASME InterPack Conference 2009, IPACK2009. vol. 1, pp. 175-182, 2009 ASME InterPack Conference, IPACK2009, San Francisco, CA, United States, 7/19/09. https://doi.org/10.1115/InterPACK2009-89236
Husain A, Kim KY. Numerical optimization of a electroosmotically enhanced microchannel heat sink. In Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 1. 2010. p. 175-182 https://doi.org/10.1115/InterPACK2009-89236
Husain, Afzal ; Kim, Kwang Yong. / Numerical optimization of a electroosmotically enhanced microchannel heat sink. Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 1 2010. pp. 175-182
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