Impact Behavior of Deformable Pin-Reinforced PU Foam Sandwich Structure

Shivanku Chauhan, Mohd Zahid Ansari*, Sonika Sahu, Afzal Husain

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Present work studies the effect of deformable silicone rubber pin reinforcement on impact and energy absorption characteristics of polymer sandwich structure. Low-density polyurethane foam is used as core material and acrylic sheets as the two skin. The size of the sandwich structure is 50 × 50 × 35 mm. Material properties of core and skin were determined from experiments and were used later in the numerical analysis software ABAQUS. Results for deformation and stresses produced inside the sandwich for 4 J of impact energy. Results show that by reinforcing the sandwich structure with deformable silicone pins, the maximum deflections are reduced to about half, and its post-impact recovery is improved.

Original languageEnglish
Title of host publicationAdvances in Manufacturing and Industrial Engineering - Select Proceedings of ICAPIE 2019
EditorsRanganath M. Singari, Kaliyan Mathiyazhagan, Harish Kumar
PublisherSpringer Science and Business Media Deutschland GmbH
Pages997-1005
Number of pages9
ISBN (Print)9789811585418
DOIs
Publication statusPublished - 2021
Externally publishedYes
EventInternational Conference on Advanced Production and Industrial Engineering, ICAPIE 2019 - Delhi, India
Duration: Dec 20 2019Dec 21 2019

Publication series

NameLecture Notes in Mechanical Engineering
ISSN (Print)2195-4356
ISSN (Electronic)2195-4364

Conference

ConferenceInternational Conference on Advanced Production and Industrial Engineering, ICAPIE 2019
Country/TerritoryIndia
CityDelhi
Period12/20/1912/21/19

Keywords

  • Energy absorption
  • Finite element analysis
  • Polyurethane foam
  • Sandwich composite
  • Silicone rubber

ASJC Scopus subject areas

  • Automotive Engineering
  • Aerospace Engineering
  • Mechanical Engineering
  • Fluid Flow and Transfer Processes

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