FREE CONVECTION HEAT TRANSFER OF Al2O3-Cu/WATER HYBRID NANOFLUID IN A RECTOTRAPEZOIDAL ENCLOSURE HEATED UNIFORMLY FROM THE BOTTOM WALL

Mohammad M. Rahman*, M. Ziad Saghir, Ioan Pop

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We investigated, numerically, the heat transfer characteristics of Al2O3-Cu/water hybrid fluid inside a rectotrapezoidal enclosure whose bottom wall is uniformly heated, the upper horizontal wall is insulated, and the remaining walls are cold. The simulated results with the proposed thermal conductivity correlation for the hybrid fluid echoed with the experimental results when the dispersed particles volume fraction is less than 2%. The results show that when the dispersed particles loading is less than one percent, the thermal efficiency index of Al2O3:Cu = 50:50 mixture in water is the highest. Besides, when these particles loading exceeds one percent, the dispersion of pure Cu nanoparticles in water gives the highest thermal efficiency index in the rectotrapezoidal cavity.

Original languageEnglish
Title of host publication5th-6th Thermal and Fluids Engineering Conference, TFEC 2021
PublisherBegell House Inc.
Pages1191-1194
Number of pages4
ISBN (Electronic)9781567005172
DOIs
Publication statusPublished - 2021
Event5th-6th Thermal and Fluids Engineering Conference, TFEC 2021 - Virtual, Online
Duration: May 26 2021May 28 2021

Publication series

NameProceedings of the Thermal and Fluids Engineering Summer Conference
Volume2021-May
ISSN (Electronic)2379-1748

Conference

Conference5th-6th Thermal and Fluids Engineering Conference, TFEC 2021
CityVirtual, Online
Period5/26/215/28/21

Keywords

  • Free Convection
  • Nanofluid
  • finite element method
  • hybrid nanofluid
  • rectotrapezoidal enclosure

ASJC Scopus subject areas

  • Renewable Energy, Sustainability and the Environment
  • Condensed Matter Physics
  • Energy Engineering and Power Technology
  • Mechanical Engineering
  • Fluid Flow and Transfer Processes
  • Electrical and Electronic Engineering

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