Fabrication of SiC microelectromechanical systems using one-step dry etching

Liudi Jiang; R. Cheung; M. Hassan; A. J. Harris; J. S. Burdess; C. A. Zorman; M. Mehregany

doi:10.1116/1.1627804

Fabrication of SiC microelectromechanical systems using one-step dry etching

Liudi Jiang^*, R. Cheung, M. Hassan, A. J. Harris, J. S. Burdess, C. A. Zorman, M. Mehregany

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

43 Citations (Scopus)

Abstract

The development of an one-step dry etching method for fabricating silicon carbide (SiC) microelectromechanical systems was analyzed. The objective of the method was to fabricate suspended SiC cantlever and clamped bridge structures by inductively coupled plasma (ICP). The presence of tensile stress in bridge structures was observed with the help of measured resonant frequencies. But, the cantlever beams were found stress-free. The bridge length was unable to influence the degree of the tension in the bridge structures.

Original language	English
Pages (from-to)	2998-3001
Number of pages	4
Journal	Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume	21
Issue number	6
DOIs	https://doi.org/10.1116/1.1627804
Publication status	Published - 2003
Externally published	Yes

ASJC Scopus subject areas

Condensed Matter Physics
Electrical and Electronic Engineering

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abstract = "The development of an one-step dry etching method for fabricating silicon carbide (SiC) microelectromechanical systems was analyzed. The objective of the method was to fabricate suspended SiC cantlever and clamped bridge structures by inductively coupled plasma (ICP). The presence of tensile stress in bridge structures was observed with the help of measured resonant frequencies. But, the cantlever beams were found stress-free. The bridge length was unable to influence the degree of the tension in the bridge structures.",

author = "Liudi Jiang and R. Cheung and M. Hassan and Harris, {A. J.} and Burdess, {J. S.} and Zorman, {C. A.} and M. Mehregany",

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T1 - Fabrication of SiC microelectromechanical systems using one-step dry etching

AU - Jiang, Liudi

AU - Cheung, R.

AU - Hassan, M.

AU - Harris, A. J.

AU - Burdess, J. S.

AU - Zorman, C. A.

AU - Mehregany, M.

PY - 2003

Y1 - 2003

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AB - The development of an one-step dry etching method for fabricating silicon carbide (SiC) microelectromechanical systems was analyzed. The objective of the method was to fabricate suspended SiC cantlever and clamped bridge structures by inductively coupled plasma (ICP). The presence of tensile stress in bridge structures was observed with the help of measured resonant frequencies. But, the cantlever beams were found stress-free. The bridge length was unable to influence the degree of the tension in the bridge structures.

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JF - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

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ER -

Fabrication of SiC microelectromechanical systems using one-step dry etching

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