Abstract
This paper presents a mechanical model for a polysilicon double-ended tuning fork (DETF) that is implemented as force sensor. This sensor is integrated into a compliant, passive microgripper utilized in a microassembly of 3D MEMS structures. An expression for resonant frequency of DETF is derived. Theoretical model is introduced to analyze the quality factor (Q-factor) of the resonator. The DETF is found to have a maximum Q-factor of 863. In addition, the characteristics of the snap-lit interlocking mechanism are modeled analytically. An optimization scheme is employed to determine the optimal dimensions that provide a maximum reliable amplification factor (A-factor) of the microleverage mechanism. Based on the simulation, the maximum A-factor is 26.12. The model presented here permits a gauge factor (i.e., sensitivity) of 5000 ppm/μN at compressive force of 80μN and A-faclor of 25. The superior results obtained support the feasibility of DETF as a resonant force sensor for microgripping applications.
| Original language | English |
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| Title of host publication | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 6111 |
| DOIs | |
| Publication status | Published - 2006 |
| Event | Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V - San Jose, CA, United States Duration: Jan 25 2006 → Jan 26 2006 |
Other
| Other | Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V |
|---|---|
| Country/Territory | United States |
| City | San Jose, CA |
| Period | 1/25/06 → 1/26/06 |
Keywords
- DETF
- Microassembly
- Microgripper
- Microleverage
- Q factor
- Resonant sensing
- Snap fit
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Electrical and Electronic Engineering
- Applied Mathematics