Development of a mechanical model for a micromachined resonant force sensor used in passive microgripping applications

Issam B. Bahadur; James K. Mills

doi:10.1117/12.644429

Development of a mechanical model for a micromachined resonant force sensor used in passive microgripping applications

Issam B. Bahadur^*, James K. Mills

^*Corresponding author for this work

Mechanical and Industrial Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper presents a mechanical model for a polysilicon double-ended tuning fork (DETF) that is implemented as force sensor. This sensor is integrated into a compliant, passive microgripper utilized in a microassembly of 3D MEMS structures. An expression for resonant frequency of DETF is derived. Theoretical model is introduced to analyze the quality factor (Q-factor) of the resonator. The DETF is found to have a maximum Q-factor of 863. In addition, the characteristics of the snap-lit interlocking mechanism are modeled analytically. An optimization scheme is employed to determine the optimal dimensions that provide a maximum reliable amplification factor (A-factor) of the microleverage mechanism. Based on the simulation, the maximum A-factor is 26.12. The model presented here permits a gauge factor (i.e., sensitivity) of 5000 ppm/μN at compressive force of 80μN and A-faclor of 25. The superior results obtained support the feasibility of DETF as a resonant force sensor for microgripping applications.

Original language	English
Title of host publication	Proceedings of SPIE - The International Society for Optical Engineering
Volume	6111
DOIs	https://doi.org/10.1117/12.644429
Publication status	Published - 2006
Event	Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V - San Jose, CA, United States Duration: Jan 25 2006 → Jan 26 2006

Other

Other	Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V
Country	United States
City	San Jose, CA
Period	1/25/06 → 1/26/06

Keywords

DETF
Microassembly
Microgripper
Microleverage
Q factor
Resonant sensing
Snap fit

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Electrical and Electronic Engineering
Applied Mathematics

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Bahadur, IB & Mills, JK 2006, Development of a mechanical model for a micromachined resonant force sensor used in passive microgripping applications. in Proceedings of SPIE - The International Society for Optical Engineering. vol. 6111, 61110H, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V, San Jose, CA, United States, 1/25/06. https://doi.org/10.1117/12.644429

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title = "Development of a mechanical model for a micromachined resonant force sensor used in passive microgripping applications",

abstract = "This paper presents a mechanical model for a polysilicon double-ended tuning fork (DETF) that is implemented as force sensor. This sensor is integrated into a compliant, passive microgripper utilized in a microassembly of 3D MEMS structures. An expression for resonant frequency of DETF is derived. Theoretical model is introduced to analyze the quality factor (Q-factor) of the resonator. The DETF is found to have a maximum Q-factor of 863. In addition, the characteristics of the snap-lit interlocking mechanism are modeled analytically. An optimization scheme is employed to determine the optimal dimensions that provide a maximum reliable amplification factor (A-factor) of the microleverage mechanism. Based on the simulation, the maximum A-factor is 26.12. The model presented here permits a gauge factor (i.e., sensitivity) of 5000 ppm/μN at compressive force of 80μN and A-faclor of 25. The superior results obtained support the feasibility of DETF as a resonant force sensor for microgripping applications.",

keywords = "DETF, Microassembly, Microgripper, Microleverage, Q factor, Resonant sensing, Snap fit",

author = "Bahadur, {Issam B.} and Mills, {James K.}",

year = "2006",

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AU - Bahadur, Issam B.

AU - Mills, James K.

PY - 2006

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N2 - This paper presents a mechanical model for a polysilicon double-ended tuning fork (DETF) that is implemented as force sensor. This sensor is integrated into a compliant, passive microgripper utilized in a microassembly of 3D MEMS structures. An expression for resonant frequency of DETF is derived. Theoretical model is introduced to analyze the quality factor (Q-factor) of the resonator. The DETF is found to have a maximum Q-factor of 863. In addition, the characteristics of the snap-lit interlocking mechanism are modeled analytically. An optimization scheme is employed to determine the optimal dimensions that provide a maximum reliable amplification factor (A-factor) of the microleverage mechanism. Based on the simulation, the maximum A-factor is 26.12. The model presented here permits a gauge factor (i.e., sensitivity) of 5000 ppm/μN at compressive force of 80μN and A-faclor of 25. The superior results obtained support the feasibility of DETF as a resonant force sensor for microgripping applications.

AB - This paper presents a mechanical model for a polysilicon double-ended tuning fork (DETF) that is implemented as force sensor. This sensor is integrated into a compliant, passive microgripper utilized in a microassembly of 3D MEMS structures. An expression for resonant frequency of DETF is derived. Theoretical model is introduced to analyze the quality factor (Q-factor) of the resonator. The DETF is found to have a maximum Q-factor of 863. In addition, the characteristics of the snap-lit interlocking mechanism are modeled analytically. An optimization scheme is employed to determine the optimal dimensions that provide a maximum reliable amplification factor (A-factor) of the microleverage mechanism. Based on the simulation, the maximum A-factor is 26.12. The model presented here permits a gauge factor (i.e., sensitivity) of 5000 ppm/μN at compressive force of 80μN and A-faclor of 25. The superior results obtained support the feasibility of DETF as a resonant force sensor for microgripping applications.

KW - DETF

KW - Microassembly

KW - Microgripper

KW - Microleverage

KW - Q factor

KW - Resonant sensing

KW - Snap fit

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BT - Proceedings of SPIE - The International Society for Optical Engineering

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