Development of a mechanical model for a micromachined resonant force sensor used in passive microgripping applications

Issam B. Bahadur, James K. Mills

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a mechanical model for a polysilicon double-ended tuning fork (DETF) that is implemented as force sensor. This sensor is integrated into a compliant, passive microgripper utilized in a microassembly of 3D MEMS structures. An expression for resonant frequency of DETF is derived. Theoretical model is introduced to analyze the quality factor (Q-factor) of the resonator. The DETF is found to have a maximum Q-factor of 863. In addition, the characteristics of the snap-lit interlocking mechanism are modeled analytically. An optimization scheme is employed to determine the optimal dimensions that provide a maximum reliable amplification factor (A-factor) of the microleverage mechanism. Based on the simulation, the maximum A-factor is 26.12. The model presented here permits a gauge factor (i.e., sensitivity) of 5000 ppm/μN at compressive force of 80μN and A-faclor of 25. The superior results obtained support the feasibility of DETF as a resonant force sensor for microgripping applications.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
Volume6111
DOIs
Publication statusPublished - 2006
EventReliability, Packaging, Testing, and Characterization of MEMS/MOEMS V - San Jose, CA, United States
Duration: Jan 25 2006Jan 26 2006

Other

OtherReliability, Packaging, Testing, and Characterization of MEMS/MOEMS V
CountryUnited States
CitySan Jose, CA
Period1/25/061/26/06

Fingerprint

Force Sensor
forks
Tuning
tuning
Quality Factor
sensors
Sensors
Amplification
Q factors
Microassembly
Resonant Frequency
Resonator
Micro-electro-mechanical Systems
Polysilicon
Model
Theoretical Model
locking
Gages
microelectromechanical systems
MEMS

Keywords

  • DETF
  • Microassembly
  • Microgripper
  • Microleverage
  • Q factor
  • Resonant sensing
  • Snap fit

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Applied Mathematics

Cite this

Bahadur, I. B., & Mills, J. K. (2006). Development of a mechanical model for a micromachined resonant force sensor used in passive microgripping applications. In Proceedings of SPIE - The International Society for Optical Engineering (Vol. 6111). [61110H] https://doi.org/10.1117/12.644429

Development of a mechanical model for a micromachined resonant force sensor used in passive microgripping applications. / Bahadur, Issam B.; Mills, James K.

Proceedings of SPIE - The International Society for Optical Engineering. Vol. 6111 2006. 61110H.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bahadur, IB & Mills, JK 2006, Development of a mechanical model for a micromachined resonant force sensor used in passive microgripping applications. in Proceedings of SPIE - The International Society for Optical Engineering. vol. 6111, 61110H, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V, San Jose, CA, United States, 1/25/06. https://doi.org/10.1117/12.644429
Bahadur IB, Mills JK. Development of a mechanical model for a micromachined resonant force sensor used in passive microgripping applications. In Proceedings of SPIE - The International Society for Optical Engineering. Vol. 6111. 2006. 61110H https://doi.org/10.1117/12.644429
Bahadur, Issam B. ; Mills, James K. / Development of a mechanical model for a micromachined resonant force sensor used in passive microgripping applications. Proceedings of SPIE - The International Society for Optical Engineering. Vol. 6111 2006.
@inproceedings{2b45200735974f1cb198dd37b3c1324f,
title = "Development of a mechanical model for a micromachined resonant force sensor used in passive microgripping applications",
abstract = "This paper presents a mechanical model for a polysilicon double-ended tuning fork (DETF) that is implemented as force sensor. This sensor is integrated into a compliant, passive microgripper utilized in a microassembly of 3D MEMS structures. An expression for resonant frequency of DETF is derived. Theoretical model is introduced to analyze the quality factor (Q-factor) of the resonator. The DETF is found to have a maximum Q-factor of 863. In addition, the characteristics of the snap-lit interlocking mechanism are modeled analytically. An optimization scheme is employed to determine the optimal dimensions that provide a maximum reliable amplification factor (A-factor) of the microleverage mechanism. Based on the simulation, the maximum A-factor is 26.12. The model presented here permits a gauge factor (i.e., sensitivity) of 5000 ppm/μN at compressive force of 80μN and A-faclor of 25. The superior results obtained support the feasibility of DETF as a resonant force sensor for microgripping applications.",
keywords = "DETF, Microassembly, Microgripper, Microleverage, Q factor, Resonant sensing, Snap fit",
author = "Bahadur, {Issam B.} and Mills, {James K.}",
year = "2006",
doi = "10.1117/12.644429",
language = "English",
isbn = "0819461539",
volume = "6111",
booktitle = "Proceedings of SPIE - The International Society for Optical Engineering",

}

TY - GEN

T1 - Development of a mechanical model for a micromachined resonant force sensor used in passive microgripping applications

AU - Bahadur, Issam B.

AU - Mills, James K.

PY - 2006

Y1 - 2006

N2 - This paper presents a mechanical model for a polysilicon double-ended tuning fork (DETF) that is implemented as force sensor. This sensor is integrated into a compliant, passive microgripper utilized in a microassembly of 3D MEMS structures. An expression for resonant frequency of DETF is derived. Theoretical model is introduced to analyze the quality factor (Q-factor) of the resonator. The DETF is found to have a maximum Q-factor of 863. In addition, the characteristics of the snap-lit interlocking mechanism are modeled analytically. An optimization scheme is employed to determine the optimal dimensions that provide a maximum reliable amplification factor (A-factor) of the microleverage mechanism. Based on the simulation, the maximum A-factor is 26.12. The model presented here permits a gauge factor (i.e., sensitivity) of 5000 ppm/μN at compressive force of 80μN and A-faclor of 25. The superior results obtained support the feasibility of DETF as a resonant force sensor for microgripping applications.

AB - This paper presents a mechanical model for a polysilicon double-ended tuning fork (DETF) that is implemented as force sensor. This sensor is integrated into a compliant, passive microgripper utilized in a microassembly of 3D MEMS structures. An expression for resonant frequency of DETF is derived. Theoretical model is introduced to analyze the quality factor (Q-factor) of the resonator. The DETF is found to have a maximum Q-factor of 863. In addition, the characteristics of the snap-lit interlocking mechanism are modeled analytically. An optimization scheme is employed to determine the optimal dimensions that provide a maximum reliable amplification factor (A-factor) of the microleverage mechanism. Based on the simulation, the maximum A-factor is 26.12. The model presented here permits a gauge factor (i.e., sensitivity) of 5000 ppm/μN at compressive force of 80μN and A-faclor of 25. The superior results obtained support the feasibility of DETF as a resonant force sensor for microgripping applications.

KW - DETF

KW - Microassembly

KW - Microgripper

KW - Microleverage

KW - Q factor

KW - Resonant sensing

KW - Snap fit

UR - http://www.scopus.com/inward/record.url?scp=33646053819&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33646053819&partnerID=8YFLogxK

U2 - 10.1117/12.644429

DO - 10.1117/12.644429

M3 - Conference contribution

SN - 0819461539

SN - 9780819461537

VL - 6111

BT - Proceedings of SPIE - The International Society for Optical Engineering

ER -