Development of a mechanical model for a micromachined resonant force sensor used in passive microgripping applications

Issam B. Bahadur*, James K. Mills

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a mechanical model for a polysilicon double-ended tuning fork (DETF) that is implemented as force sensor. This sensor is integrated into a compliant, passive microgripper utilized in a microassembly of 3D MEMS structures. An expression for resonant frequency of DETF is derived. Theoretical model is introduced to analyze the quality factor (Q-factor) of the resonator. The DETF is found to have a maximum Q-factor of 863. In addition, the characteristics of the snap-lit interlocking mechanism are modeled analytically. An optimization scheme is employed to determine the optimal dimensions that provide a maximum reliable amplification factor (A-factor) of the microleverage mechanism. Based on the simulation, the maximum A-factor is 26.12. The model presented here permits a gauge factor (i.e., sensitivity) of 5000 ppm/μN at compressive force of 80μN and A-faclor of 25. The superior results obtained support the feasibility of DETF as a resonant force sensor for microgripping applications.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
DOIs
Publication statusPublished - 2006
Externally publishedYes
EventReliability, Packaging, Testing, and Characterization of MEMS/MOEMS V - San Jose, CA, United States
Duration: Jan 25 2006Jan 26 2006

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6111
ISSN (Print)0277-786X

Other

OtherReliability, Packaging, Testing, and Characterization of MEMS/MOEMS V
Country/TerritoryUnited States
CitySan Jose, CA
Period1/25/061/26/06

Keywords

  • DETF
  • Microassembly
  • Microgripper
  • Microleverage
  • Q factor
  • Resonant sensing
  • Snap fit

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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