Corrosion of copper in BTA solutions

Ashraf T. Al-Hinai; Kwadwo Osseo-Asare

doi:10.1149/1.1561278

Corrosion of copper in BTA solutions

Ashraf T. Al-Hinai, Kwadwo Osseo-Asare^*

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

22 Citations (Scopus)

Abstract

The effect of benzotriazole (BTA) on the open-circuit potential of copper in buffered acid solutions was studied in the absence of the passive Cu(I)BTA film. The film was removed from the surface by in situ continuous scratching of the electrode. At a film-free surface BTA acted mainly as a cathodic inhibitor in contrast to its well-established role as an anodic inhibitor at the film-covered copper surface. The implications for chemical mechanical polishing of copper in BTA-containing slurries are discussed.

Original language	English
Pages (from-to)	B23-B24
Journal	Electrochemical and Solid-State Letters
Volume	6
Issue number	5
DOIs	https://doi.org/10.1149/1.1561278
Publication status	Published - May 2003
Externally published	Yes

ASJC Scopus subject areas

General Chemical Engineering
General Materials Science
Physical and Theoretical Chemistry
Electrochemistry
Electrical and Electronic Engineering

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AB - The effect of benzotriazole (BTA) on the open-circuit potential of copper in buffered acid solutions was studied in the absence of the passive Cu(I)BTA film. The film was removed from the surface by in situ continuous scratching of the electrode. At a film-free surface BTA acted mainly as a cathodic inhibitor in contrast to its well-established role as an anodic inhibitor at the film-covered copper surface. The implications for chemical mechanical polishing of copper in BTA-containing slurries are discussed.

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Corrosion of copper in BTA solutions

Abstract

ASJC Scopus subject areas

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