Corrosion of copper in BTA solutions

Ashraf T. Al-Hinai, Kwadwo Osseo-Asare

Research output: Contribution to journalArticle

19 Citations (Scopus)

Abstract

The effect of benzotriazole (BTA) on the open-circuit potential of copper in buffered acid solutions was studied in the absence of the passive Cu(I)BTA film. The film was removed from the surface by in situ continuous scratching of the electrode. At a film-free surface BTA acted mainly as a cathodic inhibitor in contrast to its well-established role as an anodic inhibitor at the film-covered copper surface. The implications for chemical mechanical polishing of copper in BTA-containing slurries are discussed.

Original languageEnglish
JournalElectrochemical and Solid-State Letters
Volume6
Issue number5
DOIs
Publication statusPublished - May 2003

Fingerprint

Copper
corrosion
Corrosion
copper
inhibitors
slurries
Chemical mechanical polishing
Slurries
polishing
Electrodes
acids
Acids
electrodes
benzotriazole
Networks (circuits)

ASJC Scopus subject areas

  • Electrochemistry
  • Materials Science(all)

Cite this

Corrosion of copper in BTA solutions. / Al-Hinai, Ashraf T.; Osseo-Asare, Kwadwo.

In: Electrochemical and Solid-State Letters, Vol. 6, No. 5, 05.2003.

Research output: Contribution to journalArticle

Al-Hinai, Ashraf T. ; Osseo-Asare, Kwadwo. / Corrosion of copper in BTA solutions. In: Electrochemical and Solid-State Letters. 2003 ; Vol. 6, No. 5.
@article{b7fe5c2ade014a08be949ece29d19b55,
title = "Corrosion of copper in BTA solutions",
abstract = "The effect of benzotriazole (BTA) on the open-circuit potential of copper in buffered acid solutions was studied in the absence of the passive Cu(I)BTA film. The film was removed from the surface by in situ continuous scratching of the electrode. At a film-free surface BTA acted mainly as a cathodic inhibitor in contrast to its well-established role as an anodic inhibitor at the film-covered copper surface. The implications for chemical mechanical polishing of copper in BTA-containing slurries are discussed.",
author = "Al-Hinai, {Ashraf T.} and Kwadwo Osseo-Asare",
year = "2003",
month = "5",
doi = "10.1149/1.1561278",
language = "English",
volume = "6",
journal = "Electrochemical and Solid-State Letters",
issn = "1099-0062",
publisher = "Electrochemical Society, Inc.",
number = "5",

}

TY - JOUR

T1 - Corrosion of copper in BTA solutions

AU - Al-Hinai, Ashraf T.

AU - Osseo-Asare, Kwadwo

PY - 2003/5

Y1 - 2003/5

N2 - The effect of benzotriazole (BTA) on the open-circuit potential of copper in buffered acid solutions was studied in the absence of the passive Cu(I)BTA film. The film was removed from the surface by in situ continuous scratching of the electrode. At a film-free surface BTA acted mainly as a cathodic inhibitor in contrast to its well-established role as an anodic inhibitor at the film-covered copper surface. The implications for chemical mechanical polishing of copper in BTA-containing slurries are discussed.

AB - The effect of benzotriazole (BTA) on the open-circuit potential of copper in buffered acid solutions was studied in the absence of the passive Cu(I)BTA film. The film was removed from the surface by in situ continuous scratching of the electrode. At a film-free surface BTA acted mainly as a cathodic inhibitor in contrast to its well-established role as an anodic inhibitor at the film-covered copper surface. The implications for chemical mechanical polishing of copper in BTA-containing slurries are discussed.

UR - http://www.scopus.com/inward/record.url?scp=0037652280&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0037652280&partnerID=8YFLogxK

U2 - 10.1149/1.1561278

DO - 10.1149/1.1561278

M3 - Article

VL - 6

JO - Electrochemical and Solid-State Letters

JF - Electrochemical and Solid-State Letters

SN - 1099-0062

IS - 5

ER -