Bonding Wire Interconnects between MMIC for 5-GHz Intra/Inter-Chip Communications

Zia Nadir*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The modeling of the bonding-wire connectivity is the focus of this paper. The goal was to transfer as much power as possible while minimizing return loss (Insertion loss). We utilized a program called High Frequency Structure Simulator to get the job done (HFSS®). Wires of various geometries are evaluated to acquire good results. In addition to the squares, there were also circles and half-hexagons. Equivalent series and shunt capacitances create a low-pass network to describe this characteristic. Using this approach, the bonding-wire discontinuity can be more easily matched. Few experiments were also carried out, with positive outcomes.

Original languageEnglish
Title of host publication19th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology, ECTI-CON 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665485845
DOIs
Publication statusPublished - 2022
Event19th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology, ECTI-CON 2022 - Prachuap Khiri Khan, Thailand
Duration: May 24 2022May 27 2022

Publication series

Name19th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology, ECTI-CON 2022

Conference

Conference19th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology, ECTI-CON 2022
Country/TerritoryThailand
CityPrachuap Khiri Khan
Period5/24/225/27/22

Keywords

  • Bonding wires
  • Interconnects
  • Millimeter wave
  • MMIC

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Artificial Intelligence
  • Computer Science Applications
  • Hardware and Architecture
  • Information Systems
  • Signal Processing
  • Electrical and Electronic Engineering

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