Bond graph modeling and simulation of mechatronic systems

M. A. Malik, A. Khurshid

Research output: Chapter in Book/Report/Conference proceedingConference contribution

18 Citations (Scopus)

Abstract

The traditional modeling and simulation techniques for dynamic systems are generally adequate for single-domain systems only. Mechatronic systems, being a mix of mechanical and electronic systems, deal with multi-domain systems. Such systems may typically include translational, rotational, thermofluid, electrical, electromechanical and electronic systems. Modeling and simulation of such multi-domain systems pose formidable new challenges and, hence, demand new strategies and techniques for reliable solutions. The bond graph method (BGM) is rapidly emerging to offer a new modeling and simulation methodology that is ideally suited to effectively unify knowledge pertaining to multi-domain systems for mechatronic applications. The BGM combined with genetic programming (GP) offers tremendous opportunities in artificial intelligence, image processing, and robotic and industrial automation, The extension of BGM for applications to fields such as social behavior, economics and operational research is a very active topic of current research. This work illustrates the methodology offered by BGM for modeling and simulation of mechatronic systems.

Original languageEnglish
Title of host publicationProceedings - INMIC 2003: IEEE 7th International Multi Topic Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages309-314
Number of pages6
ISBN (Print)0780381831, 9780780381834
DOIs
Publication statusPublished - 2003
Event7th IEEE International Multi Topic Conference, INMIC 2003 - Islamabad, Pakistan
Duration: Dec 8 2003Dec 9 2003

Other

Other7th IEEE International Multi Topic Conference, INMIC 2003
CountryPakistan
CityIslamabad
Period12/8/0312/9/03

Fingerprint

Bond Graph
Mechatronics
Modeling and Simulation
Genetic programming
Artificial intelligence
Dynamical systems
Robotics
Image processing
Automation
Economics
Electronics
Social Behavior
Methodology
Combined Method
Operations Research
Genetic Programming
Dynamic Systems
Artificial Intelligence
Image Processing

Keywords

  • Bonding
  • Circuits
  • Computational modeling
  • Decision making
  • Flow graphs
  • Genetics
  • Humans
  • Mechatronics
  • Predictive models
  • Robotics and automation

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Computer Science Applications
  • Hardware and Architecture
  • Signal Processing
  • Modelling and Simulation

Cite this

Malik, M. A., & Khurshid, A. (2003). Bond graph modeling and simulation of mechatronic systems. In Proceedings - INMIC 2003: IEEE 7th International Multi Topic Conference (pp. 309-314). [1416738] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/INMIC.2003.1416738

Bond graph modeling and simulation of mechatronic systems. / Malik, M. A.; Khurshid, A.

Proceedings - INMIC 2003: IEEE 7th International Multi Topic Conference. Institute of Electrical and Electronics Engineers Inc., 2003. p. 309-314 1416738.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Malik, MA & Khurshid, A 2003, Bond graph modeling and simulation of mechatronic systems. in Proceedings - INMIC 2003: IEEE 7th International Multi Topic Conference., 1416738, Institute of Electrical and Electronics Engineers Inc., pp. 309-314, 7th IEEE International Multi Topic Conference, INMIC 2003, Islamabad, Pakistan, 12/8/03. https://doi.org/10.1109/INMIC.2003.1416738
Malik MA, Khurshid A. Bond graph modeling and simulation of mechatronic systems. In Proceedings - INMIC 2003: IEEE 7th International Multi Topic Conference. Institute of Electrical and Electronics Engineers Inc. 2003. p. 309-314. 1416738 https://doi.org/10.1109/INMIC.2003.1416738
Malik, M. A. ; Khurshid, A. / Bond graph modeling and simulation of mechatronic systems. Proceedings - INMIC 2003: IEEE 7th International Multi Topic Conference. Institute of Electrical and Electronics Engineers Inc., 2003. pp. 309-314
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