Analyses of strips metallization effect on the delay time of integrated circuit elements

H. Bourdoucen, A. Issaoun, M. Djeddi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, the quasi-static parameters of planer lossless multiconductor transmission line systems are computed using the semi-analytical method of lines with non-equidistant discretization. The effect of metallization thickness on the capacitance and inductance matrices of these structures is considerably affected by the metallization thickness of the conductor strips. The relative variations of this time delay (td) with respect to zero thickness approximation time delay for the studied structures reach about 20% for t/w of 30%. The computed results show good agreement with data available in the literature.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherPubl by IEEE
Pages1051-1054
Number of pages4
ISBN (Print)0780307941
Publication statusPublished - 1993
Event1993 Proceedings of the 43rd Electronic Components and Technology Conference - Orlando, FL, USA
Duration: Jun 1 1993Jun 4 1993

Other

Other1993 Proceedings of the 43rd Electronic Components and Technology Conference
CityOrlando, FL, USA
Period6/1/936/4/93

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Bourdoucen, H., Issaoun, A., & Djeddi, M. (1993). Analyses of strips metallization effect on the delay time of integrated circuit elements. In Proceedings - Electronic Components and Technology Conference (pp. 1051-1054). Publ by IEEE.