TY - JOUR
T1 - Multiobjective optimization of a grooved micro-channel heat sink
AU - Ansari, Danish
AU - Husain, Afzal
AU - Kim, Kwang Yong
N1 - Funding Information:
Manuscript received July 11, 2009; revised July 10, 2010; accepted August 8, 2010. Date of publication November 22, 2010; date of current version December 22, 2010. This work was supported by the National Research Foundation of Korea, under Grant 2009-0083510, funded by the Korean Government, Ministry of Education, Science and Technology (MEST), through the Multi-Phenomena CFD Engineering Research Center. Recommended for publication by Associate Editor T. Lee upon evaluation of reviewers’ comments.
PY - 2010/12
Y1 - 2010/12
N2 - The shape optimization of a micro-channel heat sink with a grooved structure has been performed using a multiobjective evolutionary algorithm. The thermal-resistance and pumping-power characteristics of the micro-channel heat sink have been investigated numerically. For optimization, four design variables, i.e., the ratios of the groove depth to the micro-channel height, the groove pitch to the micro-channel height, the groove diameter to pitch, and the micro-channel width to height are selected. The thermal resistance and the pumping power are the objective functions. The Navier-Stokes and energy equations for laminar flow and conjugate heat transfer are solved using a finite-volume solver. In comparison with a smooth micro-channel, a decrease in the thermal resistance and an increase in the Nusselt number are obtained in a grooved micro-channel at the expense of pumping power. The thermal resistance in a grooved micro-channel is lower than that in a smooth micro-channel for a fixed pumping power. The ratio of the groove pitch to micro-channel height is found to be the most Pareto-sensitive (sensitive along the Pareto-optimal front), whereas the ratio of the micro-channel width to height is found to be the least Pareto-sensitive variable.
AB - The shape optimization of a micro-channel heat sink with a grooved structure has been performed using a multiobjective evolutionary algorithm. The thermal-resistance and pumping-power characteristics of the micro-channel heat sink have been investigated numerically. For optimization, four design variables, i.e., the ratios of the groove depth to the micro-channel height, the groove pitch to the micro-channel height, the groove diameter to pitch, and the micro-channel width to height are selected. The thermal resistance and the pumping power are the objective functions. The Navier-Stokes and energy equations for laminar flow and conjugate heat transfer are solved using a finite-volume solver. In comparison with a smooth micro-channel, a decrease in the thermal resistance and an increase in the Nusselt number are obtained in a grooved micro-channel at the expense of pumping power. The thermal resistance in a grooved micro-channel is lower than that in a smooth micro-channel for a fixed pumping power. The ratio of the groove pitch to micro-channel height is found to be the most Pareto-sensitive (sensitive along the Pareto-optimal front), whereas the ratio of the micro-channel width to height is found to be the least Pareto-sensitive variable.
KW - Electronic cooling
KW - groove
KW - heat-transfer enhancement
KW - micro-channel
KW - optimization
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U2 - 10.1109/TCAPT.2010.2070874
DO - 10.1109/TCAPT.2010.2070874
M3 - Article
AN - SCOPUS:78651104673
SN - 1521-3331
VL - 33
SP - 767
EP - 776
JO - IEEE Transactions on Components and Packaging Technologies
JF - IEEE Transactions on Components and Packaging Technologies
IS - 4
M1 - 5643121
ER -