Bond graph modeling and simulation of mechatronic systems

M. A. Malik, A. Khurshid

نتاج البحث

20 اقتباسات (Scopus)

ملخص

The traditional modeling and simulation techniques for dynamic systems are generally adequate for single-domain systems only. Mechatronic systems, being a mix of mechanical and electronic systems, deal with multi-domain systems. Such systems may typically include translational, rotational, thermofluid, electrical, electromechanical and electronic systems. Modeling and simulation of such multi-domain systems pose formidable new challenges and, hence, demand new strategies and techniques for reliable solutions. The bond graph method (BGM) is rapidly emerging to offer a new modeling and simulation methodology that is ideally suited to effectively unify knowledge pertaining to multi-domain systems for mechatronic applications. The BGM combined with genetic programming (GP) offers tremendous opportunities in artificial intelligence, image processing, and robotic and industrial automation, The extension of BGM for applications to fields such as social behavior, economics and operational research is a very active topic of current research. This work illustrates the methodology offered by BGM for modeling and simulation of mechatronic systems.

اللغة الأصليةEnglish
عنوان منشور المضيفProceedings - INMIC 2003: IEEE 7th International Multi Topic Conference
ناشرInstitute of Electrical and Electronics Engineers Inc.
الصفحات309-314
عدد الصفحات6
رقم المعيار الدولي للكتب (المطبوع)0780381831, 9780780381834
المعرِّفات الرقمية للأشياء
حالة النشرPublished - 2003
الحدث7th IEEE International Multi Topic Conference, INMIC 2003 - Islamabad
المدة: ديسمبر ٨ ٢٠٠٣ديسمبر ٩ ٢٠٠٣

Other

Other7th IEEE International Multi Topic Conference, INMIC 2003
الدولة/الإقليمPakistan
المدينةIslamabad
المدة١٢/٨/٠٣١٢/٩/٠٣

ASJC Scopus subject areas

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