TY - GEN
T1 - Analyses of strips metallization effect on the delay time of integrated circuit elements
AU - Bourdoucen, H.
AU - Issaoun, A.
AU - Djeddi, M.
PY - 1993
Y1 - 1993
N2 - In this paper, the quasi-static parameters of planer lossless multiconductor transmission line systems are computed using the semi-analytical method of lines with non-equidistant discretization. The effect of metallization thickness on the capacitance and inductance matrices of these structures is considerably affected by the metallization thickness of the conductor strips. The relative variations of this time delay (td) with respect to zero thickness approximation time delay for the studied structures reach about 20% for t/w of 30%. The computed results show good agreement with data available in the literature.
AB - In this paper, the quasi-static parameters of planer lossless multiconductor transmission line systems are computed using the semi-analytical method of lines with non-equidistant discretization. The effect of metallization thickness on the capacitance and inductance matrices of these structures is considerably affected by the metallization thickness of the conductor strips. The relative variations of this time delay (td) with respect to zero thickness approximation time delay for the studied structures reach about 20% for t/w of 30%. The computed results show good agreement with data available in the literature.
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M3 - Conference contribution
AN - SCOPUS:0027311822
SN - 0780307941
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1051
EP - 1054
BT - Proceedings - Electronic Components and Technology Conference
PB - Publ by IEEE
T2 - 1993 Proceedings of the 43rd Electronic Components and Technology Conference
Y2 - 1 June 1993 through 4 June 1993
ER -